CuW75 — eForged — Cylinder

The CuW75 eForged (Ø 25.4 × 6.35 mm) is composed of 75% tungsten and 25% copper by weight. Its theoretical density is approximately 14.0 g/cm³, combining the high thermal conductivity of copper with the refractory strength and arc resistance of tungsten.

Unlike traditional press-and-sinter methods, the eForged process yields a near-full-density microstructure with superior grain uniformity. This results in improved thermal and electrical conductivity, tighter dimensional tolerances, and enhanced mechanical reliability under cyclic thermal loads.

The Ø 25.4 × 6.35 mm format is widely used as a heat spreader or thermal submount in high-power electronics, as an EDM electrode blank, and as an electrical contact element in high-voltage switchgear. It is also suitable for aerospace arcing contacts and semiconductor base plates.

Yes. CuW75 eForged discs can be further machined (turning, milling, grinding, wire EDM) to meet your exact specifications. The eForged microstructure ensures consistent machinability with minimal tool wear compared to conventional copper-tungsten composites.

Every CuW75 eForged disc ships with a downloadable certificate of analysis detailing composition (W/Cu ratio), density, hardness, and lot traceability. Technical datasheets and MSDS documents are also available in PDF format on the product page.